GOOT GSR-300 Convection Rework System ( BGA, CSP, QFP, SMD)

This is a high quality SMT rework/repair system combining the XPR-600/1000 Preheater and the XFC-300/XFC-301 Convection Rework System that handles BGAs/CSPs. It easily handles reworking of all SMDs from chips to BGAs.

XPR-600 (Preheater)
This is a hot air type preheater with digital temperature display and a wide output opening to allow a large area to be heated. This assures PCBs are not damaged during reworking.

XFC-300 (Convection SMT Rework Tool)
With a wide temperature range from 50-550B°C and air flow volume range from 5-25 l/min, it handles reworking of various SMDs and PCBs. Using Auto mode, rework is possible by simply inputting the time and temperature for the desired profile, making repeat operations easy and highly efficient. 5 zones profiles available for extremely accurate rework. A wide variety of interchangeable nozzles are available in the XFC Series.

• XFC-301 includes Auto-lift function.
• Nozzles must be purchased separately.