BGA Reballing Kit for Cell Phone Chips JOVY JV-RKC

Reballing kit for cell phone chips. The set consists of 55 stencils specially designed to repair components of most popular models, pallet spatula for BGA paste application and stencil holder.

The kit is fully compatible with the upper preheater of Jovy Systems RE 7500 rework system and other soldering stations.

JOVY SYSTEMS RE-7500 demonstration video

Reballing kit includes spencil for the following BGA components

• 7650 RAM CDMAX350
  
• 708J T39 CPU
  
• V680CPU
• T30 MF T39/8310 FLASH
  
• 7210 MF 7210/7250/6100 FLASH
  
• S308 AF 7650 CPU
  
• MSM3100 CPU A760 CPU
  
• 3208C3B FLASH A760 UEM
  
• 998 MF/L2000 UEM 3310/3210 FLASH 998/V66/V70 RAM
  
• 3210/8210/8850 CPU 8810 CPU
  
• ALCATEL FLASH ALCATEL AF
  
• GD92 FLASH GD90 FLASH
  
• T2688 RAM T2688 FLASH
• XIAO YI CPU A188 CPU
• C2588 CPU 6188 CPU
  
• LU-PS966 9110 CPU
  
• T28 UEM VTECH SERIES
  
• 998/T28/T18 FLASH T189/L200/928 CPU
  
• 998T191/998
  
• 3310/3210 UEM 8210/A188 FLASH
  
• CDMA 79B71 CDMA CPU
  
• 702A CPU
  
• 998CPU/Y66 UEM 3688 UEM
  
• C6688/C3508 CPU
  
• GD90 CPU NEC2100 CPU
  
• BF RFGC AP-A102/LU-PS966 CPU
  
• V70 FLASH L2000/T191/6210 FLASH
• V70 V70
• 8210 UEM/3310/8210 RF 3110/8850/821- CHARGE IC
  
• T28/T29 CPU 8310 UEM
• 600/800 FLASH N188/N288 CPU
  
• V66/V60 CPU V66 FLASH
• 808 FKASH 6188 DSP
• V208 VIDEOTAPE C55 FLASH
• CECH16 NC P20
  
• T618 RF E700 FLASH
• C55 CPU V3 FLASH
  
• 7688 FLASH 3510 CPU
  
• T618 FLASH EPSON
  
• 6055 CPU GD55 FLASH
  
• N100 CPU E630 CPU
  
• NEC616 FLASH 9500 RAM
  
• N8 FLASH 7260 CPU
  
• E680 FLASH E708 UEM
  
• 3220 CPU 3220 MF
  
• T618 CHARGE IC E680 FLASH
  
• NEC68821 A328 AF
  
• A620 UEM AIT800G
  
• 62301 MF 3220 MF
  
• 6230 UEM 6230 CPU
  
• 7610 CPU 7250 CPU
• 6030 UEM 6630 UEM
• 6230 RAM 3220 FLASH
  
• 7650 CPU 7260 CPU
  
• 6210 FLASH 7650 MF