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GOOT XFC-200 Convection Rework System

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ID: 10595
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GOOT XFC-200 Convection Rework System. Hot air SMT rework tool which allows easy mounting and removal of SMDs including QFPs and SQLs. When changing the nozzle it can be used for mounting and removing SMDs including discrete chips.
Input Voltage: 220 V
Weight: 6.5 kg

  Price     USD 735     Suggest your price

This is a hot air SMT rework tool which allows easy mounting and removal of SMDs including QFPs and SQLs. When changing the nozzle it can be used for mounting and removing SMDs including discrete chips. For higher operating efficiency of the tool use preheater Goot XPR-600.

Features:
  • Easy handling with the ergonomic handpiece.
  • Various types of nozzles available.
  • With the quick connector, changing nozzle is fast and easy
  • ESD safe.
  • Heater ON/OFF is controlled by the foot switch XFS-1. (Option)
  • Mounting/ removing of SMDs is easy with the Vacuum Pickup function.
  • The Air Flow Meter makes it easy to manage the air flow volume.
Technical specifications:

Voltage
100-130VAC 220-240V AC
Power Consumption
430-470W, 380-420W
Heater Voltage
110-120, 220-240V AC 450W
Heater Wattage
400—450W
Temperature Setting Range
150° C—450°C
Airflow Volume Range
5—20l /min
Airflow Meter
Equipped
Vacuum Pickup
Integrated into Handpiece
Max. Vacuum Pressure
-0.03Mpa (-220mmHg)
Insulation resistance (500V DC)
Over 10MΩ
Dimensions Soldering Unit
220mm (w/o cord)
Control Unit
227(L)× 107(W) × 177(H)
Weight Soldering Unit
200g (w/o cord)
Control Unit
4.6kg (w/o cord)
Control Unit to Soldering Unit Hose Length
1m
Power Cord Length
1.1m
Input Voltage: 220 V
Weight: 6.5 kg

  Price     USD 735     Suggest your price

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